MQX.tracE 2.5D X-ray inspection cabinet with operator console

MQX.tracE · 2.5D X-ray for electronics

Engineered to reveal the invisible.

India's first indigenous 2.5D PCB X-ray inspection system, built for micron-level defect detection in high-density electronic assemblies, revealing solder voids, cracks, bridging, missing BGAs and PTH fill issues that visual inspection cannot catch.

India's first indigenous 2.5D system2D and 3D CT in one platformAERB type-approvedUp to 7,500× (CT variant)

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Overview Variants 2.5D Highlights CT IN-3D Gallery Specs

One platform. Three depths of answer.

Where 2D leaves ambiguity, MQX.tracE CT adds 3D slicing and reconstruction to isolate layers, verify internal geometry and generate evidence-ready reports without destructive sectioning. MQX.tracE | IN-3D brings inline 2D / 2.5D / 3D inspection and automated defect analysis directly into the production line. All three systems share an AI-powered imaging suite.

VariantWhat it doesChoose it when

MQX.tracE · 2.5DHigh-magnification X-ray inspection with oblique viewingFast PCB screening and detection of known solder and assembly defects are required

MQX.tracE CTAdds CT slicing and reconstruction for layer-by-layer analysisOverlapping structures make conventional X-ray views ambiguous or detailed failure analysis is required

MQX.tracE | IN-3DInline 2D / 2.5D / 3D X-ray inspection with automated defect analysis and production-line board handlingInspection must happen directly within the SMT production flow without moving boards to an offline inspection station

MQX.tracE · 2.5D

Micron-level defect detection for electronics.

Micron-level defect detection

For BGAs, QFNs, QFPs and PTH solder joints, defects measured in microns rather than millimetres.

AI-powered software

Standardized inspection and faster reporting, with less operator subjectivity.

High-throughput ready

Macros and batch inspection to scan boards in sequence.

Large inspection coverage

Very high magnification across dense assemblies.

AERB-certified safety

Leakage radiation below 1 µSv/hr for operator-safe use.

System features at a glance.

MQX.tracE inspection cabinet with operator console and imaging software on screen

MQX.tracE CT

2D gives answers. CT gives certainty.

For complex electronics, 2D views can be ambiguous because layers overlap. MQX.tracE CT combines high-clarity 2D screening with 3D slicing and reconstruction, so teams can isolate layers, verify internal geometry, confirm root cause and generate evidence-ready reports, without cutting a board apart.

Acquire (2D)Slice (CT)AnalyzeReport

Layer-by-layer CT visibility

Separate overlapping features and reduce escapes.

Faster failure analysis and R&D cycles

Evidence-ready slices with no physical sectioning.

Standardized inspection workflows

Manual, semi-automatic and automatic modes, plus macros.

Advanced measurement tools

Package and semiconductor analysis with pass/fail support.

Safe, compliant operation

Radiation safety below 1 µSv/hr at the cabinet surface.

MQX.tracE | IN-3D

Inspection built into the SMT production flow.

An inline X-ray solution for PCB and electronic assemblies, combining 2D / 2.5D / 3D inspection, automated defect analysis, in-line board handling and Industry 4.0 integration without moving boards to an offline station.

Inline multimode inspection

Run routine 2D screening, oblique 2.5D inspection and full 3D analysis on one production-line platform.

Automated defect analysis

Standardize defect detection and retain inspection results and per-joint measurements for production traceability.

Production-line board handling

A linear motor and pneumatic clamping move boards through inspection without transferring them to an offline station.

Industry 4.0 integration

Write inspection results back to ERP and SPC systems for closed-loop quality monitoring.

Sample inspection images.

Representative captures from MQX.tracE, MQX.tracE CT and MQX.tracE | IN-3D.

X-ray of a row of plated through-hole solder joints in a carrier, with internal voids visible as bright inclusions — PTH solder jointsVoids visible as bright inclusions inside each barrel.

Annotated X-ray of four PTH joints with measurement cylinders, outlined voids and fill and void percentages per barrel — The same joints, measuredFill and void percentages calculated automatically.

X-ray of a quad flat package showing bond wires and large irregular voids in the die attach layer — QFP die-attach voidingLarge irregular voids beneath the die, every bond wire resolved.

X-ray of the same quad flat package with neighbouring surface-mount passives in frame — The same package, wider fieldNeighbouring passives and the full lead frame in one exposure.

X-ray of an assembled card showing a BGA array, magnetics and two connectors — Assembled boardBGA array, magnetics and connectors in a single scan.

Full-field X-ray of the same assembled card, from edge connector to mounting bracket — The same board, full fieldEdge connector to mounting bracket, with inner-layer routing visible.

Technical Specifications

Three systems, quoted separately. For 2.5D and CT, JIMA resolution describes the smallest feature the system can resolve. IN-3D detector resolution is stated as pixel pitch.

MQX.tracE · 2.5D

X-ray energy range: 20 – 160 kV
Max target power: 25 W
Tube type: Microfocus, open type, transmission target
JIMA resolution: 0.9 µm
Detector active area: 161 × 161 mm
Pixel pitch / frame rate: 105 µm / 40 fps
Manipulator: 6-axis, servo motors with encoder
Magnification: Geometric above 1,900×; system above 7,000×
Radiation safety: AERB type-approved; leakage below 1 µSv/hr
Footprint / weight: 2200 (H) × 1800 (W) × 1900 (D) mm; approx. 4500 kg

MQX.tracE CT

Power: AC mains 220 – 230 V, 50 Hz, single phase
Anode voltage: 30 – 160 kV
Target power: Up to 15 W
X-ray source: Open tube, transmission target
Resolution: 0.75 µm or better
Magnification: Geometric up to 3,000×; total up to 7,500×
Imaging: Above 1 MP; 10 fps; 16-bit ADC
Manipulator: Five-axis; 360° rotation, ±70° tilt
PCB capacity: Max 440 × 550 mm; inspection area 310 × 310 mm; sample weight 5 kg
Inspection modes: Manual / semi-automatic / automatic, plus macros
CT capability: 3D CT slicing and reconstruction
Radiation safety: Below 1 µSv/hr at cabinet surface
Image export: RAW / JPEG / TIFF / GIF / BMP
Vibration mitigation: Anti-vibration supports for stability

MQX.tracE | IN-3D

X-ray source: Sealed microfocus source, 130 kV, 39 W, 11 µm focal spot
Detector: High-resolution flat panel detector, 105 µm pixel pitch, 16-bit depth, 40 fps, real-time acquisition
Imaging modes: 2D / 2.5D / 3D
PCB capacity: Minimum 50 × 50 mm; maximum 610 × 510 mm
PCB thickness: 0.4 – 6 mm
Maximum board weight: 5 – 8 kg
Board handling: Linear motor with pneumatic clamping
Dimensions with conveyor: 3000 × 2186 × 1860 mm
Dimensions without conveyor: 1600 × 2186 × 1860 mm
System weight: 2500 kg
Software: MQS Imaging Suite on Windows, with acquisition, review and manipulator control
Production integration: Results and per-joint measurements written back to ERP and SPC

Compare all three on your own boards

Request a demonstration of MQX.tracE 2.5D, MQX.tracE CT and MQX.tracE | IN-3D against your inspection requirement.

Request a demo

Engineered to reveal the invisible.

One platform. Three depths of answer.

Micron-level defect detection for electronics.

Micron-level defect detection

AI-powered software

High-throughput ready

Large inspection coverage

AERB-certified safety

System features at a glance.

2D gives answers. CT gives certainty.

Layer-by-layer CT visibility

Faster failure analysis and R&D cycles

Standardized inspection workflows

Advanced measurement tools

Safe, compliant operation

Inspection built into the SMT production flow.

Inline multimode inspection

Automated defect analysis

Production-line board handling

Industry 4.0 integration

Sample inspection images.

Technical Specifications

MQX.tracE · 2.5D

MQX.tracE CT

MQX.tracE | IN-3D

Compare all three on your own boards

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